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ZXSBMR16PT8 MR16: Schottky bridge rectifier plus freewheel diode
Summary
Schottky Bridge and Freewheel diode for use in MR16 LED Drive Internal Ambient Temperature = 90C MAX* VR =13.2VRMS; IF = 0.4AAVG; IR = 10A *within MR16 circuit enclosure
Description
This low leakage Schottky bridge and freewheel diode have been specifically designed for the MR16 LED driver solution alongside ZXLD1350E5 as described in Design Note DN86.
SM8
DC OUT C
Key benefits
* Compact surface mount solution and reduced component count in MR16 LED drive circuit
AC IN
Features
* * Optimized bridge and freewheel diode for use in MR16 LED diode circuitry Low VF and low reverse leakage current
GND
A
Ordering information
Device ZXSBMR16PT8TA Reel size (inches) 7 Tape width (mm) 12 Quantity per reel 1000
N/C GND GND A
AC IN DC OUT AC IN C
Device marking
ZXSB MR16P Pinout - top view
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ZXSBMR16PT8
Application Schematic from DN86
ZXLD1350E5 ZXSBMR16PT8
Absolute maximum ratings
Parameter Bridge Maximum repetitive reverse voltage Maximum RMS bridge input voltage Average rectified forward current(a)(b) Peak repetitive forward current Non repetitive forward current t=100s t=10ms Package Power dissipation at Tamb=25C(a) Storage temperature range Junction temperature forward dissipation only Junction temperature reverse dissipation(a)(b)(c) MR16 LED internal ambient temperature(d) PD Tstg Tj Tj Tamb 1 -55 to +150 150 125 90 W C C C C VRRM VRMS IF(AV) IFPK IFSM 40 13.2 0.4 3.5 13 3.5 V V A A A A Symbol Value Unit
Thermal characteristics
Parameter Junction to ambient(a) Symbol R JA Limit 125 Unit C/W
NOTES: (a) For a bridge mounted on1.6mm FR4 PCB with minimum copper pads and track dimensions in still air. (b) Supply 12V RMS with capacitive bridge load. (c) Maximum bridge operating junction temperature must be reduced with increased reverse bias voltage to maintain unconditional thermal stability. (d) Refer to Design Note DN86
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ZXSBMR16PT8
Electrical characteristics per diode (at Tamb = 25C unless otherwise stated)
Schottky diode characteristics Parameter Reverse breakdown voltage Forward voltage Symbol V(BR)R VF Min. 40 305 355 405 485 570 640 415 Reverse current Diode capacitance Reverse recovery time Reverse recovery charge IR CD trr Qrr 6 370 16 3 210 10 360 410 470 550 660 750 Typ. Max. Unit V mV mV mV mV mV mV mV A A pF ns pC Conditions IR=200A IF=50mA (*) IF=100mA(*) IF=250mA(*) IF=500mA(*) IF=750mA(*) IF=1A(*) IF=500mA(*),Ta = 100C VR=30V VR=30V,Ta = 85C f=1MHz,VR=30V Switched from IF = 500mA to VR = 5.5V Measured @ IR 50mA. di/dt = 500mA/ns. Rsource = 6;Rload = 10
NOTES: (*) Measured under pulsed conditions. Pulse width = 300s; duty cycle 2%.
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ZXSBMR16PT8
Typical characteristics single diode
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ZXSBMR16PT8
Package outline - SM8
DIM Min. A A1 b c D E 0.02 0.24 6.3 3.3
Millimeters Max. 1.7 0.1 0.32 6.7 3.7 Typ. 0.7 Min. 0.0008 0.009 0.248 0.130
Inches Max. 0.067 0.004 0.013 0.264 0.145 Typ. 0.0275 -
DIM Min. e1 e2 He Lp 6.7 0.9 -
Millimeters Max. 7.3 15 Typ. 4.59 1.53 10 Min. 0.264 0.035 -
Inches Max. 0.287 15 Typ. 0.1807 0.0602 10
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
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ZXSBMR16PT8
Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user's application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex' terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: "Preview" Future device intended for production at some point. Samples may be available "Active" Product status recommended for new designs "Last time buy (LTB)" Device will be discontinued and last time buy period and delivery is in effect "Not recommended for new designs" Device is still in production to support existing designs and production "Obsolete" Production has been discontinued Datasheet status key: "Draft version" This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. "Provisional version" This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. "Issue" This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. Zetex sales offices Europe Zetex GmbH Kustermann-park Balanstrae 59 D-81541 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com
(c) 2008 Published by Zetex Semiconductors plc
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